AI Summary FANUC America will showcase AI, collaborative robotics, and machine vision for package handling, verification, food processing, packaging, and palletizing at PACK EXPO International 2026 in Chicago, Booth N25217. Why this matters for automation buyers: FANUC’s packaging-focused demos signal continued convergence of robots, vision, and AI controls, so procurement teams should evaluate integration requirements, PLC and sensor compatibility, and flexible automation roadmaps before specifying new packaging cells.